ACES-金属冲压件

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Bracket

Customized Brackets
CPU fan bracket

Processes: Electroplating, soldering, screw insertion, thin film bonding.
EMI Shielding

Material: SPTE, SGCC
Thickness: 0.15~0.3mm Bonding
material: Insulating PET film
IO Shielding

Used for the Input & Output positions on the motherboard.
Processes: Insertion, printing, thin film bonding.
Medium to large-sized chassis assembly components
Medium-sized structural components

Processes: Electroplating, soldering, baking paint, insertion, printing, thin film bonding
Mid-size computer case

Processes: Electroplating, baking paint, printing, insertion, assembly
Thin stainless steel structural parts
Types and sizes of aluminum structural exterior parts
Types of medium-sized sturdy framework brackets

Material: SPCC, SGCC
Bonding material: Thermal conductive adhesive
Processes: Electroplating, baking paint, insertion, printing, thin film bonding